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| STA264 Sirius overlay decoder Data Brief Features De-multiplexes the incoming overlay data stream from the G3 Baseband processor Maximal Ratio Combines the signals from the three streams of data (TDM1, TDM2, COFDM) Performs diversity combining two demodulated soft symbol streams Utilizes internal TDM demodulators for diversity combining cost sensitive applications Performs error correction on the overlay data Closes the processing loop to control the Diversity Combiner or accepts second L2 input for internal combining Presents data to external application processors Channels I2S data from Baseband to Application Processors - Data can be uncompressed audio - Data can be "Data" Receives SSPv2 Commands - UART - Parse data for Overlay and Legacy tune commands - Navigation TFBGA249 Controls the Baseband Processor and DSP via UART ports - Required so theApplication Processor can interface to a single client Provides commands to the Application Processor Memory Interfaces - SDR SDRAM to support the four second buffer and de-interleaving - FLASH for the storage of Firmware Description The STA264 ASIC is a fully integrated processor for Sirius Satellite Digital Radio Service (SDARS) that allows for decoding of Layer 2 hierarchical data. Table 1. Device summary Order code STA264 STA264TR Package TFBGA249 TFBGA249 Packing Tray Tape and reel July 2007 Rev 2 1/6 www.st.com 6 For further information contact your local STMicroelectronics sales office. Application block diagram STA264 1 Application block diagram Figure 1. Application block diagram SDRAM 16M x 16 FLASH 2Mx16 A/V decoder ADC CTRL IF ADC Data STA264 Overlay Decoder Data Service Processor Master Controller Audio/I 2S STA210N Tuner FE IF I2C IFAGC Data Audio/I 2S STA240/260 Baseband Processor Data AC00243 2/6 STA264 Electrical characteristics 2 2.1 Electrical characteristics Absolute maximum ratings Table 2. Symbol VDD_core VDD_io VDDD_pll VDDA_pll VDDA_otp VDDA_saf Tstg Toper Tj Absolute maximum ratings Parameter Core 1.2V Power supply Voltage IO Ring 3.3V Power Supply Voltage PLL 1.2V Power supply Voltage PLL 2.5V Power supply Voltage OTP 2.5V Power supply Voltage OTP 2.5V Power supply Voltage Storage Temperature Operative Ambient Temperature Operative Junction Temperature Value 1.32 3.6 1.32 2.75 2.75 2.75 -50 to +150 -40 to +85 -40 to +125 Unit V V V V V V C C C 2.2 Thermal data Table 3. Symbol Rj-amb Thermal data Parameter Thermal Resistance junction to ambient(1) Value 35 Unit C/W 1. According to JEDEC specification on a 4 layers board 3/6 Package information STA264 3 Package information In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a Lead-free second level interconnect. The category of second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Figure 2. TFBGA 249 mechanical data and package dimensions mm DIM. MIN. A A1 A2 A3 A4 b D D1 E E1 e F ddd eee fff 0.350 0.400 0.210 0.790 0.200 0.600 TYP. MAX. 1.200 0.0083 0.0311 0.0079 0.0236 MIN. TYP. MAX. 0.0472 inch OUTLINE AND MECHANICAL DATA 0.450 0.0138 0.0157 0.0177 14.850 15.000 15.150 0.5846 0.5906 0.5965 12.800 0.5039 14.850 15.000 15.150 0.5846 0.5906 0.5965 12.800 0.800 1.100 0.100 0.150 0.080 0.5039 0.0315 0.0433 0.0039 0.0059 0.0031 TFBGA 240+9 (15x15x1.2mm) Thin Profile Pitch Ball Grid Array 7272773 C 4/6 STA264 Revision history 4 Revision history Table 4. Date 18-Jun-2007 13-Jul-2007 Document revision history Revision 1 2 Initial release. Updated the features section. Changes 5/6 STA264 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST'S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER'S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. (c) 2007 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 6/6 |
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